HP-808
HP-808 Hot Plate Operating Specifications
Appropriate Substrates:
Two things are necessary for achieving good results.
1. Planar bottom surface
2. Substrate must be at least as thermally conductive as G10 epoxy glass laminate.
Substrate Limit:
7.5" x 7.5"
Temperature Range:
Ambient to 280șC
Temperature Monitoring:
Bimetal Thermo switch
Heating Zones:
8" x 8" heat plate
Dimensions:
Length = 9.5", Width = 9.5", Height = 2"
Shipping Weight:
6 lbs.
Power Requirements:
6A @ 115 Vac,
220 Vac models also available
Facilities Requirements:
Table mounted, no facilities requirements when operated in open area.
HP-808 Hot Plate Features
Reflow Soldering / Curing:
Our STI family of hot plates are the SMT/Hybrid standard for reflow soldering, curing, and repair. Bottom side heat technology allows for safe preheating and curing of substrates and SMT boards.
Thermal Shock:
The HP-808 is an excellent preheat tools for repair work on substrates and components. Our hot plate are ideal for curing epoxy and silicon encapsulations.
Hot Plate Conductive Surface:
The thermal conductive surface has a non-stick finish. The bottom surface transfers the heat from the bottom up, heating the substrate and solder joints, rather than temperature sensitive components.
Simple Operation:
The HP-808 is a self-contained plate. They have a safety fuse, illuminated On/Off switch, a thermal switch with a temperature adjustment, and a heat "ON" lamp indicator. These allow for safe operation in a lab or a production environment.
Easy to Profile:
The operation has a complete control and view of the hot plate profile. A single front panel control is used to adjust the temperature setting.
Repeatable Operation:
Profiling of the HP-808 can be easily adjusted for different applications by adjusting the front panel control at the proper set point for the selected profile.
*Also available with an armrest.