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HP-808-PV
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HP-808-PV
Hot Plate Operating Specifications
Appropriate
Substrates:
Two
things are necessary for achieving good results.
1.
Planar bottom surface
2.
Substrate must be at least as thermally conductive as G10 epoxy glass
laminate.
Substrate
Limit:
7.5"
x 7.5"
Temperature
Range:
Ambient to 260șC
Temperature
Monitoring:
Digital PID controller
Heating
Zones:
8"
x 8" heat plate
Dimensions:
Length
= 9.5", Width = 9.5", Height = 2"
Shipping
Weight:
8 lbs.
Power
Requirements:
6A
@ 115 Vac
220
Vac models also available
Facilities
Requirements:
Table
mounted, no facilities requirements when operated in open area.
House vacuum needed if vacuum pump not ordered.
HP-808-PV Hot Plate Features
Reflow
Soldering / Curing:
Our
STI family of hot plates are the SMT/Hybrid standard for reflow soldering,
curing, and repair. Bottom side heat technology allows for safe
preheating and curing of substrates and SMT boards.
Thermal
Shock:
The
HP-808-PV is an excellent preheat tools for repair work on substrates and
components. Our hot plates are ideal for curing epoxy and silicon
encapsulations.
Hot
Plate Conductive Surface:
The
thermal conductive surface has a non-stick finish. The bottom surface
transfers the heat from the bottom up, heating the substrate and solder
joints, rather than temperature sensitive components.
Simple
Operation:
The
HP-808-PV consists of the plate and a control box. The controlled boxed
can be placed away from the plate with a cable length of 45 inches. The
plate has a heat "ON" lamp indicator. The control box has a
safety fuse, illuminated On/Off switch for power and a On/Off switch for
heat. The temperature is controlled by a digital PID controller that
allows precise temperature measuring and settings. The digital PID
controller also incorporates an alarm for safety These allow for safe
operation in a lab or a production environment.
Easy
to Profile:
The
operation has a complete control and view of the hot plate
profile. A single Digital PID controller is used to adjust the temperature
setting.
Repeatable
Operation:
Profiling
of the HP-808-PV can be easily adjusted for different applications by adjusting
the front panel control at the proper set point for the selected profile.
HP-808-PV Hot Plate Additional Features
Has the same features as the HP-808-P except it incorporates a vacuum, built in or supplied by house.
A
small hole is placed on the top plate that
will keep the part in place while the vacuum is turned on.
The vacuum can be toggled on and off by a flick of a switch.
*Also available with an armrest.
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