HP-303-350
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HP-303-350 Hot Plate Operating Specifications
Appropriate Substrates:
Two things are necessary for achieving good results.
1. Planar bottom surface
2. Substrate must be at least as thermally conductive as G10 epoxy glass laminate.
Substrate Limit:
2.5" x 2.5"
Temperature Range:
Ambient to 350șC
Temperature Monitoring:
Bimetal Thermo switch
Heating Zones:
3" x 3" heat plate
Dimensions:
Length = 4.25", Width = 4.25", Height = 3.5"
Shipping Weight:
4 lbs
Power Requirements:
3A @ 115 Vac
220 Vac models also available
Facilities Requirements:
Table mounted, no facilities requirements when operated in open area.
HP-303-350 Hot Plate Features
Reflow Soldering / Curing:
Our STI family of hot plates are the SMT/Hybrid standard for reflow soldering, curing, and repair. Bottom side heat technology allows for safe preheating and curing of substrates and SMT boards.
Thermal Shock:
The HP-303-350 is an excellent preheat tools for repair work on substrates and components. Our hot plates are ideal for curing epoxy and silicon encapsulations.
Hot Plate Conductive Surface:
The thermal conductive surface has a non-stick finish. The bottom surface transfers the heat from the bottom up, heating the substrate and solder joints, rather than temperature sensitive components.
Simple Operation:
The HP-303-350 is a self-contained plate. They have a safety fuse, illuminated On/Off switch, a thermal switch with a temperature adjustment, and a heat "ON" lamp indicator. These allow for safe operation in a lab or a production environment.
Easy to Profile:
The operation has a complete control and view of the hot plate profile. A single front panel control is used to adjust the temperature setting.
Repeatable Operation:
Profiling of the HP-303-350 can be easily adjusted for different applications by adjusting the front panel control at the proper set point for the selected profile.