HP2-608-P2
HP2-608-P2 Hot Plate Operating Specifications
Appropriate Substrates:
Two things are necessary for achieving good results.
1. Planar bottom surface
2. Substrate must be at least as thermally conductive as G10 epoxy glass laminate.
Substrate Limit:
2 Zones of 3.5" x 5.5"
Temperature Range:
Ambient to 280șC
Temperature Monitoring:
Duel Digital PID controller (one for each zone)
Heating Zones:
2 Zones of 4" x 6" hot plate
Dimensions:
Length = 11", Width = 7.5", Height = 2"
Shipping Weight:
9 lbs
Power Requirements:
4A @ 115 Vac
Facilities Requirements:
Table mounted, no facilities requirements when operated in open area.
HP2-608-P2 Hot Plate Features
Reflow Soldering / Curing:
Our STI family of hot plates are the SMT/Hybrid standard for reflow soldering, curing, and repair. Bottom side heat technology allows for safe preheating and curing of substrates and SMT boards.
Thermal Shock:
The HP2-608-P2 is an excellent preheat tools for repair work on substrates and components. Our hot plates are ideal for curing epoxy and silicon encapsulations.
Hot Plate Conductive Surface:
The thermal conductive surface has a non-stick finish. The bottom surface transfers the heat from the bottom up, heating the substrate and solder joints, rather than temperature sensitive components.
Simple Operation:
The HP2-608-P2 is a self-contained plate. They have a safety fuse, illuminated On/Off switch, a digital PID controller for temperature control, and a heat "ON" lamp indicator. These allow for safe operation in a lab or a production environment.
Easy to Profile:
The operation has a complete control and view of the hot plate profile. A single front panel control is used to adjust the temperature setting.
Repeatable Operation:
Profiling of the HP2-608-P2 can be easily adjusted for different applications by adjusting the front panel control at the proper set point for the selected profile.