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Phoenix 3600 Family

High Quality Phoenix Picture
Phoenix
Hot Plate Operating Specifications
Appropriate
Substrates:
Two
things are necessary for achieving good results.
1.
Planar bottom surface
2.
Substrate must be at least as thermally conductive as G10 epoxy glass
laminate.
Substrate
Limit:
The
size limit is always 1/2" less than the width of the belt.
Temperature
Range:
Ambient
to 350șC
Temperature
Monitoring:
Digital
PID controller for each zone.
Heating
Method:
Hot
plate heating through a conductive belt transporting substrates.
Heating
Zones:
Each
hot plate is 4" long with a width of 6".
The
Phoenix has typically 5 heat zones and 1 cool zone
Optional zone configurations per customer request.
Dimensions:
36"
x 19" x 7"
Belt
Drive:
Smooth
flow variable speed geared DC motor. Solid state motor controller.
Belt
Speed:
Infinitely
variable from 2 to 130 inches/minute. We also offer option slow speed
modification which will allow speeds from 0.5 to 90 inches/minute.
Phoenix Hot Plate Features
The Phoenix reflow/curing systems outperforms all other reflow systems in
the soldering of SMT and Hybrid assemblies. Attributing to this is it's
Higher Temperatures, Increased Throughput, Greater Flexibility, and Fewer Risks
involved than with conventional hot plate systems.
Phoenix Features:
Increased
Belt Speed:
With
the Top IR, Solder joints receive more controlled heat than with the hot
plate reflow systems. This reduces the risks associated with remaining
in the reflow state for an extended period of time and results in greater
throughput.
Seamless
Belt:
A
seamless belt allows for automatic loading of the Phoenix family machines, making
it unnecessary for loading equipment o recognize and avoid placing substrates
on the belt seam or pusher bars.
Heat
Safety Guard:
The
surface temperatures of the heat chamber walls make it essential to prevent
operator contact with the chamber. The heat safety guard which is a
perforated metal shroud surrounding the camber, performs this task.
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